ALLE KATEGORIEN0138
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FERRITE BEAD AXIAL LEAD 86 OHMS,EMI/RFI Suppressors & Ferrites 86ohms 100MHz 5A Thru-hole
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 320000
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FERRITE BEAD AXIAL LEAD 220 OHMS,EMI/RFI Suppressors & Ferrites 220ohms 100MHz 5A Thru-hole
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 121000
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FERRITE BEAD AXIAL LEAD 153 OHMS,EMI/RFI Suppressors & Ferrites 153ohms 100MHz 5A Thru-hole
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 121000
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FERRITE BEAD AXIAL LEAD 135 OHMS,EMI/RFI Suppressors & Ferrites 135ohms 100MHz 5A Thru-hole
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9000
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FERRITE BEAD AXIAL LEAD 75 OHMS,EMI/RFI Suppressors & Ferrites 75ohms 100MHz 5A Thru-hole
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 121000
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Q:What defines the physical structure of 0138?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB integration.
- Central thermal pad (80% coverage) for efficient heat dissipation.
- 38-pin layout with perimeter array for balanced signal distribution.
- 0.8 mm ultra-thin profile enabling space-constrained designs. -
Q:Why choose 0138 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is 0138 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62090).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2652R).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for hidden joint verification.