0805 (2012 Metric)
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NTCS0805E3103JLT
Hersteller: Vishay Beyschlag/Draloric/BC Components
Verpackung/Behälter: 0805 (2012 Metric)
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THERMISTOR NTC 10KOHM 3430K 0805
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9535
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CAP FEEDTHRU 22UF 20% 6.3V 0805
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6650
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SENSOR PHOTO 900NM TOP VIEW 0805
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6756
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LED RED/YLW-GRN 0805 SMD BOT ENT
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 7821
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SENSOR PHOTO 570NM TOP VIEW 0805
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6080
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RF POWER DVDR 400MHZ-900MHZ 0805
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 5991
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THERMISTOR NTC 10KOHM 3590K 0805
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 7439
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1:2 LTCC TRANSFORMER, 240 - 770
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 8761
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1:2 LTCC TRANSFORMER, 900 - 2300
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 7789
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1:2 LTCC TRANSFORMER, 1275 - 220
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6710
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1:1 LTCC TRANSFORMER, 1650 - 285
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9058
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FIXED IND 22UH 220MA 1.25OHM SMD
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9611
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FIXED IND 6.8UH 550MA 250MOHM SM
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9786
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FIXED IND 2.2UH 800MA 120MOHM SM
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 8353
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FIXED IND 3.3UH 500MA 200MOHM SM
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 8363
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Q:What defines the physical structure of 0805 (2012 Metric)?
A:Key features include:
- Standardized dimensions: 2.0 mm × 1.25 mm (L × W) body size.
- Rectangular ceramic body: Leadless design with metalized terminations on both ends.
- Symmetrical layout: Ensures balanced solder joint formation.
- Thin profile: Typical height of 0.5 mm for low-profile PCB integration. -
Q:Why choose 0805 (2012 Metric) over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than 1206 packages, saving PCB space.
- Thermal Performance: Efficient heat dissipation through ceramic substrate.
- Electrical Benefits: Low parasitic inductance (<1 nH) for high-frequency stability.
- Reliability: Robust construction resistant to mechanical stress and thermal cycling. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 mm × 1.25 mm (2012 Metric).
- Height: 0.5 mm (typical).
- Termination Pitch: 1.25 mm (center-to-center).
- Material: Ceramic body with nickel/tin-plated terminations.
- Temp Range: -55°C to +125°C (operational). -
Q:Where is 0805 (2012 Metric) typically applied?
A:Dominant use cases:
- Consumer Electronics: Decoupling capacitors in smartphones (e.g., MLCCs).
- Power Supplies: Filtering circuits in DC-DC converters (e.g., Murata GRM series).
- Automotive: Sensor signal conditioning modules (e.g., TDK CGA/CGB types). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Ensure pad spacing matches 1.25 mm pitch; avoid tombstoning with symmetric pads.
- Solder Paste: Type 3 or 4 recommended for precise deposition.
- Reflow Profile: Peak temperature ≤ 260°C (SnAgCu solder).
- Inspection: Optical inspection (AOI) to verify solder fillet formation.



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