ALLE KATEGORIEN10-VFDFN Exposed Pad
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IC REG BUCK ADJ 3A 10VSON
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1 + 10 + 25 + 50 + >=100 -
1
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IC REG BUCK ADJ 3A 10VSON
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1 + 10 + 25 + 50 + >=100 -
1
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ELECTRONIC SWITCH FOR POWER LINE
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 7924
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IC ELECTRONIC FUSE 10DFN
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 5783
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3A DDR / VTT TERMINATION
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9130
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IC PWR SWITCH N-CHAN 1:1 10QFN
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9370
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IC REG LINEAR POS ADJ 1.5A 10DFN
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9056
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IC REG LINEAR POS ADJ 3A 10DFN
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 5690
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IC REG LINEAR POS ADJ 2A 10DFN
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9436
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IC REG LDO
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 369
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Conv DC-DC 3.1V to 5.5V Synchronous Step Down Single-Out 0.6V to 3.3V 3A 10-Pin VSON EP T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Conv DC-DC 5.5V to 28V Step Down Single-Out 0.75V to 7.5V 3A Automotive 10Pin MLPD EP T/R
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6500
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Switching Voltage Regulators Std 1ch Boost Nosync VSON010V3030 w/FET
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1463
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Voltage Regulators - Switching Regulators High Eff Sngl Indctr buck-boost
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6532
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Conv DC-DC 3.5V to 60V Synchronous Step Down Single-Out 0.8V to 58V 0.5A 10-Pin VSON EP T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Conv DC-DC 3V to 5.5V Synchronous Step Down Single-Out 0.75V to 5.225V 3A 10Pin MLPD T/R
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 17487
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Conv DC-DC 3V to 5.5V Synchronous Step Down Single-Out 0.75V to 5.225V 2A 10Pin MLPD EP T/R
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 9939
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3.0 W mono class-D audio amplifier
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 980
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IC BUCK SYNC DRIVER DL TDSON10-2
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2143
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Battery Management USB Slp/chrg w/o INT pin w/1.5V Threshold
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 985
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4-bit Fm I2C-bus low power LED driver
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 100
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Voltage Mode PWM Controller 0.6V to 12V 25A 330kHz 10Pin DFN EP
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 50
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INTERSIL ISL80111IRAJZ-T7A LDO Voltage Regulator, Adjustable, 1V to 3.6V input, 27mV drop., 0.8V to 3.3V/1A out, DFN-10
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 250
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LDO Regulator Pos 0.8V to 5V 1A 10-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 160
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AUTOMOTIVE GRADE HIGH/FULL SPEED USB 2.0 SWITCH W/HIGH ESD, HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 16980
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MOSFET DRVR 3A 2Out Hi/Lo Side Inv/Non-Inv 10Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 5000
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Q:What defines the physical structure of 10-VFDFN Exposed Pad?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 10-pin layout with dual-row arrangement: Optimizes space efficiency.
- 0.8 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose 10-VFDFN Exposed Pad over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant (MSL3) substrate for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is 10-VFDFN Exposed Pad typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62825).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under exposed pad (0.3 mm diameter).
- Solder Paste: Type 4 (5–15 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad voiding checks.