1812 (4532 metric)

Q:What defines the physical structure of 1812 (4532 metric)?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: ~60% coverage for enhanced heat dissipation.
- 2-pin layout with side-terminated design: Simplified connectivity.
- 1.2 mm ultra-thin profile: Saves vertical space in compact designs.

Q:Why choose 1812 (4532 metric) over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller than 1210 packages for high-density PCBs.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<1nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (per IPC-7351B).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 4.5 mm × 3.2 mm (4532 metric).
- Height: 1.2 mm.
- Pin Pitch: 2.5 mm.
- Material: Copper-alloy terminations with Ni/Sn plating.
- Temp Range: -55°C to +150°C (military-grade options available).

Q:Where is 1812 (4532 metric) typically applied?

A:Dominant use cases:
- Power Converters: E.g., Buck/boost regulators (TPS62130).
- RF Modules: E.g., Antenna matching circuits (RFPA1812).
- Sensor Interfaces: E.g., Current-shunt monitoring (INA181).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (≥4) under central pad for heat sinking.
- Solder Paste: Type 4 solder (particle size 20–38 μm) recommended.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free) with 60–90 sec above 217°C.
- Inspection: X-ray (AXI) mandatory to verify voiding <15%.