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6-VDFN

The 6-VDFN (Very-thin Dual Flat No-leads) is a surface-mount package designed for high-density circuits. Featuring a leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation, reduced signal interference, and space-saving integration. Typical dimensions are 3.0×3.0 mm with a 0.5 mm pin pitch and 0.9 mm height, making it ideal for power management ICs in portable devices, RF modules, and IoT sensors. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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