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DMP-8
DMP-8
The DMP-8 (Dual Mold Package 8-pin) is a surface-mount package designed for high-density circuits. Featuring a leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 3×3 mm with a 0.5 mm pin pitch and a height of 0.8 mm, making it ideal for power management ICs in portable devices, IoT sensors, and wearable electronics. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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C-MOS COMPARATOR WITH OPEN DRAIN OUTPUT,Comparator ICs cmos w/open drain
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2953
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 28000
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C-MOS COMPARATOR WITH C-MOS OUTPUT,Comparator ICs cmos comparator with cmos output
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1404
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IC OPAMP CMOS DUAL LOW-PWR 8-DMP
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 67500
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 67500
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IC OPAMP CMOS DUAL LOW-PWR 8-DMP
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 67500
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2500
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 3600
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2.5-V Precision Micropower Shunt Voltage Reference, 0.5% accuracy 5-SC70 -40 to 85
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1 + 10 + 25 + 50 + >=100 -
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2.5-V Precision Micropower Shunt Voltage Reference, 0.5% accuracy 3-SOT-23 -40 to 85
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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10-V Precision Micropower Shunt Voltage Reference, 0.5% accuracy 5-SC70 -40 to 85
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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Op Amps Dual
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 6000
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Op Amps Dual
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 180
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Q:What defines the physical structure of DMP-8?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 8-pin layout with dual-row arrangement: Balances pin density and signal integrity.
- 0.6 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose DMP-8 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 2.0 mm
- Height: 0.6 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is DMP-8 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.