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FBGA484

The FBGA484 (Fine Ball Grid Array 484) is a surface-mount package designed for high-density circuits. Featuring a fine-pitch ball grid array, leadless design, and ultra-thin profile, it delivers compact size and superior heat dissipation. Typical dimensions are 23×23 mm with a height of 1.4 mm and a 1.0 mm pin pitch, making it ideal for mobile devices, networking equipment, and automotive electronics. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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