FBGA484
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FPGA Fusion? Family 1.5M Gates 1098.9MHz 130nm Technology 1.5V 484-Pin FBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 45
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FPGA MAX 10 Family 25000 Cells 55nm Technology 1.2V 484Pin TFBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 20
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FPGA Artix-7 Family 215360 Cells 28nm Technology 1V 484Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 300
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FPGA Spartan-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 90
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FPGA Virtex®-6 LXT Family 74496 Cells 40nm (CMOS) Technology 1V 484Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 532
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FPGA Virtex?-6 LXT Family 128000 Cells 40nm Technology 0.9V 484-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2000
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FPGA Virtex?-6 LXT Family 128000 Cells 40nm Technology 0.9V 484-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2000
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Circuit Breaker Thermal 1Pole 1A 250VAC/50VDC
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2000
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Virtex-6 LXT FPGA 240 I/O 484FCBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2000
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FPGA VIRTEX-6 LXT FAMILY 128000 CELLS 40NM (CMOS) TECHNOLOGY
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 35
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FPGA Virtex?-6 LXT Family 128000 Cells 40nm Technology 1V 484-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2000
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Field Programmable Gate Array, 3411 CLBs, 667MHz, 43661-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, LEAD FREE, FBGA-484
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1000
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FPGA Spartan®-6 LX Family 147443 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 225
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Extended Spartan-3A FPGAs, Package: 4FGG484C
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 287
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FPGA XA Spartan®-6 Family 43661 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 240
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FPGA XA Spartan®-3E Family 1.6M Gates 33192 Cells 572MHz 90nm Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 59
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FPGA - Field Programmable Gate Array 33.3K LUTs 295 I/O 1.2V -6 Speed IND
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 258
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FPGA FLEX 10KE Family 30K Gates 1728 Cells 200MHz 0.22um Technology 2.5V 484-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 4650
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FPGA Cyclone III Family 119088 Cells 437.5MHz 65nm Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1800
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FullFlex Synchronous SDR Dual Port SRAM,SRAM 512K x 72 90nm SDR 36M SYNC DUAL PORT
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 44
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FullFlex(TM) Synchronous SDR Dual Port SRAM; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V; Speed: 167 MHz,
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 100
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FullFlex(TM) Synchronous SDR Dual-Port SRAM; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V; Speed: 167 MHz,SRAM 2M x 72 SDR 36M SYNC DUAL PORT
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 12
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FLEx72 3.3V 64K/128K/256K x 72 Synchronous Dual-Port RAM,SRAM 18M Sync Dual Port 256K x 72 3.3V COM
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 25
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FLEx72 3.3V 64K/128K/256K x 72 Synchronous Dual-Port RAM,SRAM 128K x 72 3.3V IND Sync Dual Port
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 103
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FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 484-Pin FBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 31
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ProASIC3 Flash FPGA 1500K System Gates,FPGA - Field Programmable Gate Array 1500K System Gates
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 17
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Q:What defines the physical structure of FBGA484?
A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable solder joints and space efficiency.
- Central thermal pad (70% coverage): Enhances heat dissipation for high-power applications.
- 484-pin layout with staggered ball arrangement: Optimizes signal routing density.
- 1.2 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose FBGA484 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 23×23 mm
- Height: 1.2 mm
- Ball Pitch: 0.8 mm
- Material: Lead-free solder balls (SAC305 alloy)
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is FBGA484 typically applied?
A:Dominant use cases:
- AI/GPU processors: e.g., NVIDIA Jetson modules.
- High-speed memory: e.g., DDR4/LPDDR4 interfaces.
- Telecom infrastructure: e.g., 5G baseband ICs. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal via array under the pad (0.3mm diameter).
- Solder Paste: Type 4 solder with 88% metal content.
- Reflow Profile: Peak temp ≤ 250°C (60 sec above 217°C).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).



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