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FBGA-484

The FBGA-484 (Fine-Pitch Ball Grid Array 484) is a surface-mount package designed for high-density integrated circuits. Featuring a leadless design, fine-pitch ball grid array, and ultra-thin profile, it delivers superior thermal dissipation and minimized signal inductance. Typical dimensions are 23×23 mm with a 1.0 mm ball pitch and 1.2 mm height, making it ideal for memory modules (such as DDR SDRAM), portable electronics, and networking equipment. Its bottom-terminal ball contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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