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FBGA-780
FBGA-780
The FBGA-780 (Fine-Pitch Ball Grid Array-780) is a surface-mount package designed for high-density integrated circuits. Featuring a leadless design, 780 high-density solder balls, and an exposed thermal pad, it delivers significant miniaturization, superior heat dissipation, and reduced signal path inductance. Typical dimensions are 29×29 mm with a 0.8 mm ball pitch and a profile height under 2 mm, making it ideal for high-performance computing, networking/telecom ASICs, and graphics processing units (GPUs). Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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FPGA Cyclone III LS Family 198464 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA
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FPGA - Field Programmable Gate Array Arria 10 GX 270 FPGA
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High Performance Low Power FPGA
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FPGA Cyclone? 10 GX Family 220000 Cells 20nm Technology 780-Pin FBGA
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FPGA - Field Programmable Gate Array Arria 10 GX 160 FPGA
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 2904 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 9120 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 4224 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 4224 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 4224 LABs 372 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV E 9120 LABs 488 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV E 9120 LABs 488 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV E 9120 LABs 488 IOs
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FPGA - Field Programmable Gate Array FPGA - Stratix IV E 9120 LABs 488 IOs
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Q:What defines the physical structure of FBGA-780?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad: 80% coverage for enhanced heat dissipation.
- 780-pin layout: Symmetric grid array arrangement.
- Ultra-thin profile: 1.2 mm height for space-constrained designs. -
Q:Why choose FBGA-780 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than traditional BGA packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 23 mm × 23 mm.
- Height: 1.2 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy interconnects with halogen-free substrate.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is FBGA-780 typically applied?
A:Dominant use cases:
- AI Accelerators: e.g., NVIDIA Jetson modules.
- High-Bandwidth Memory (HBM): e.g., Samsung HBM2E stacks.
- 5G Baseband Processors: e.g., Qualcomm Snapdragon X75. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under the central pad.
- Solder Paste: Type 4 (20–38 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<10% tolerance).