ALLE KATEGORIENHSOP8
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Integrierte Schaltungen (ICs)
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Integrierte Schaltungen (ICs)
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LDO Regulator Pos 3.3V 0.5A 8Pin HTSOP-J EP Embossed T/R
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ZXBM5210 Series 18 V 1.5 A Reversible DC Motor Drive with Speed Control-SOIC-8EP
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Integrierte Schaltungen (ICs)
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120VIN, 150MA, ULTRA-LOW IQ, H
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LDO Voltage Regulators ICs, Power Management, Linear Regulators, Single-Output LDO Regulators
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2A DDR BUS TERMINATION REGULATOR
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UPA2701GR Data Sheet | Data Sheet[05/2002]
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DC/DC Switching Regulators 1.8A DC/DC Step-Down Voltage Regulator
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Linear Regulators - Standard
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Integrierte Schaltungen (ICs)
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N-Channel MOSFET, 43 A, 40 V RS1G150MN, 8-Pin HSOP ROHM
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STMicroelectronics, Inc.(ST)
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Integrierte Schaltungen (ICs)
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Switching Regulator IC for Boost Converter
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Integrierte Schaltungen (ICs)
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Switching Converters, Regulators & Controllers 2A 1.5MHz 28V Nonsync Buck
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Integrierte Schaltungen (ICs)
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120VIN, 150mA, Ultra-Low IQ, High-PSRR Linear Regulator
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120VIN, 150mA, Ultra-Low IQ, High-PSRR Linear Regulator
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High Input-to-Output Isolation (1500V MIN)
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National Semiconductor(TI)
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3A SIMPLE SWITCHER®, Step-Down Voltage Regulator with Synchroniz...
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National Semiconductor(TI)
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National Semiconductor(TI)
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Off-Line LED Driver ICs
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Integrierte Schaltungen (ICs)
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Conv DC-DC 4.5V to 38V Synchronous Step Down Single-Out 0.6V to 38V 3A 8-Pin HSOP EP Tube
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Integrierte Schaltungen (ICs)
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Integrierte Schaltungen (ICs)
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Integrierte Schaltungen (ICs)
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Q:What defines the physical structure of HSOP8?
A:Key features include:
- Exposed thermal pad: Central pad (typically 2.5×2.5 mm coverage) for enhanced heat dissipation.
- Compact layout: 8-pin configuration with dual-row gull-wing leads.
- Low-profile design: 1.0 mm maximum height for space-constrained applications.
- Robust leads: Copper-alloy leads with solderable side surfaces. -
Q:Why choose HSOP8 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than standard SOP8 packages.
- Thermal Performance: Direct PCB heat sinking via exposed pad (RθJA improvements up to 40%).
- Electrical Benefits: Low-inductance (<1 nH) and reduced parasitic capacitance.
- Reliability: Moisture-resistant (MSL3) substrate with lead-free plating. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 4.9×3.9 mm (±0.2 mm tolerance).
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.65 mm (lead-to-lead spacing).
- Material: FR-4 substrate with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is HSOP8 typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TI TPS54332).
- Automotive Electronics: ECU signal conditioning modules.
- Industrial Sensors: High-density interface circuits (e.g., ADuM1201 isolators). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array (0.3 mm diameter) under the exposed pad.
- Solder Paste: Type 4 (particle size 20–38 μm) for fine-pitch leads.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: AXI (Automated X-ray) to verify pad solder voids <25%.