ALLE KATEGORIENNFBGA-337
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MCU 32-bit C28x RISC 1MB Flash 1.2V/3.3V Automotive 337-Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit Hercules TMS570 ARM Cortex R4F RISC 1024KB Flash 1.2V Automotive 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit Hercules TMS570 ARM Cortex R4F RISC 2048KB Flash 1.2V/3.3V Automotive 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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Dual-Core Delfino Microcontroller
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit Hercules TMS570 ARM Cortex R5F RISC 4Mb Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit Hercules TMS570 ARM Cortex R4F RISC 1280KB Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 32-bit C28x RISC 1MB Flash 1.2V/3.3V 337-Pin NFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 32-bit C28x RISC 1MB Flash 1.2V/3.3V 337-Pin NFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
-
-
Dual-Core Delfino Microcontroller
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1 + 10 + 25 + 50 + >=100 -
1
-
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MCU 32Bit C28x RISC 1024KB Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 32-bit C28x RISC 1MB Flash 1.2V/3.3V 337-Pin NFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
-
-
MCU 32-bit C28x RISC 1MB Flash 1.2V/3.3V 337-Pin NFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
1
-
-
Dual-Core Delfino Microcontroller
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1 + 10 + 25 + 50 + >=100 -
1
-
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MCU 16Bit/32Bit Hercules RM ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit Hercules RM ARM Cortex R4F RISC 1280KB Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 32-bit ARM Cortex R5F RISC 4MB Flash 1.2V/3.3V Automotive 337-Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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ARM MCU, ARM Cortex-R4F, 32bit, 220 MHz, 3 MB, 256 KB
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1 + 10 + 25 + 50 + >=100 -
1
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ARM Microcontrollers - MCU CHAMPION
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1 + 10 + 25 + 50 + >=100 -
1
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ARM Microcontrollers - MCU 16/32B RISC Flash MCU
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 337Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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Processors - Application Specialized Dig Media System-on- Chip
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16-bit/32-bit ARM Cortex R4F RISC 2MB Flash 1.5V/3.3V Automotive 337-Pin NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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Processors - Application Specialized Digital Media SOC
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1 + 10 + 25 + 50 + >=100 -
1
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Processors - Application Specialized Digital Media SOC
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1 + 10 + 25 + 50 + >=100 -
1
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IC DGTL MEDIA PROCESSOR 337NFBGA
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1 + 10 + 25 + 50 + >=100 -
1
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Processors - Application Specialized Digital Media SOC
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1 + 10 + 25 + 50 + >=100 -
1
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Q:What defines the physical structure of NFBGA-337?
A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable solder joints and compact PCB integration.
- Central thermal pad (80% coverage): Enhances heat dissipation for high-power applications.
- 337-pin layout with staggered array: Optimizes signal routing density and reduces crosstalk.
- 1.0 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose NFBGA-337 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than comparable FBGA packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by up to 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signal integrity.
- Reliability: Moisture-resistant substrate (MSL3 certified) for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 17×17 mm
- Height: 1.0 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy interposer with organic substrate
- Temp Range: -40°C to +125°C (industrial grade) -
Q:Where is NFBGA-337 typically applied?
A:Dominant use cases:
- AI accelerators: e.g., NVIDIA Jetson AGX Orin modules
- 5G RF front-ends: e.g., Qualcomm QPMxx power amplifiers
- Automotive ECUs: e.g., Infineon Aurix TC3xx MCUs -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm) for fine-pitch printing.
- Reflow Profile: Ramp rate ≤2°C/s, peak temp ≤245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).