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PG-TO252-3

The PG-TO252-3 is a surface-mount package designed for power semiconductor applications. Featuring an exposed thermal pad, three-terminal design, and compact footprint, it delivers superior heat dissipation and space-efficient PCB integration. Typical dimensions are 6.22 mm x 10.16 mm x 2.3 mm (width x length x height) with a 2.54 mm pin pitch, making it ideal for power management ICs, voltage regulators, and automotive systems. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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