ALLE KATEGORIENPQFP160
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Field Programmable Gate Array (FPGA)
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Microcontroller
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Texas Instruments(TI)
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PC87317VUL/PC97317VUL SuperI/O Plug and Play Compatible with ACPI Compliant Controller/Extender
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Programmierbare Logik-ICs
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STMicroelectronics, Inc.(ST)
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I/O Controller Interface IC Ultra I/O Controller
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FPGA FLEX 8000 Family 8K Gates 672 Cells 125MHz 0.42um Technology 5V 160-Pin PQFP
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Axcelerator FPGA 4K System Gates,FPGA - Field Programmable Gate Array 4K System Gates
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Integrierte Schaltungen (ICs)
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Q:What defines the physical structure of PQFP160?
A:Key features include:
- Gull-wing leads: 160 outward-bent pins for reliable PCB mounting.
- Central thermal pad: 10×10 mm coverage for enhanced heat dissipation.
- High-density layout: 160-pin configuration with perimeter pin arrangement.
- Low profile: 3.4 mm body thickness for space-constrained designs. -
Q:Why choose PQFP160 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent QFP packages.
- Thermal Performance: Exposed die pad for direct PCB heat sinking.
- Electrical Benefits: Low-inductance leads for high-frequency stability.
- Reliability: Moisture-resistant (MSL3) epoxy substrate. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 28×28 mm.
- Height: 3.4 mm (max).
- Pin Pitch: 0.65 mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C. -
Q:Where is PQFP160 typically applied?
A:Dominant use cases:
- Industrial MCUs: e.g., STM32F4 series.
- Networking ICs: e.g., Ethernet PHY chips.
- Automotive ECUs: e.g., Infineon AURIX™ microcontrollers. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under the central pad.
- Solder Paste: Type 4 (20–38 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: AXI (Automated X-ray) for lead coplanarity checks.