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QFN-16

The QFN-16 (Quad Flat No-leads-16) is a surface-mount package designed for high-density circuits. Featuring leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation, reduced signal interference, and space-saving benefits. Typical dimensions are 4×4 mm with a 0.5 mm pin pitch and 0.9 mm height, making it ideal for power management ICs, RF modules, and portable electronics. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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