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QFN-40

The QFN-40 (Quad Flat No-lead) is a surface-mount package designed for high-density circuits. Featuring leadless design, exposed thermal pad, and low profile, it delivers superior heat dissipation and compact size. Typical dimensions are 5×5 mm with a 0.5 mm pin pitch, making it ideal for power management ICs, RF modules, and microcontrollers in portable devices. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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