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QFP208

The QFP208 (Quad Flat Package 208) is a surface-mount package designed for high-density integrated circuits. Featuring 208 leads for extensive I/O, an exposed thermal pad, and a low-profile body height, it delivers compact space utilization and superior heat dissipation. Typical dimensions are 28×28 mm with a 0.5 mm pin pitch and a typical height of 1.6 mm, making it ideal for microcontrollers, processors, communication ICs, and industrial control systems. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in demanding environments.
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