QFP208
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Q:What defines the physical structure of QFP208?
A:Key features include:
- Gull-wing leads: 208 outward-bent pins for surface-mount soldering.
- Central thermal pad: Optional exposed pad (e.g., 10×10 mm coverage) for heat dissipation.
- High pin density: 208-pin layout with perimeter arrangement (52 pins per side).
- Low profile: Standard thickness of 1.4–3.0 mm for space-constrained designs. -
Q:Why choose QFP208 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent QFP packages with higher pin counts.
- Thermal Performance: Direct PCB heat dissipation via central pad (improves ΔT by ~15°C).
- Electrical Benefits: Short lead lengths reduce inductance (<1 nH) for high-speed signals.
- Reliability: Moisture-resistant (MSL3) substrate and robust lead joints for industrial use. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 28×28 mm (varies by vendor).
- Height: 1.4–3.0 mm (depends on leadframe design).
- Pin Pitch: 0.5 mm (fine-pitch variant available at 0.4 mm).
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is QFP208 typically applied?
A:Dominant use cases:
- Embedded Systems: Microcontrollers (e.g., STM32F7 series).
- Networking: Ethernet PHY chips (e.g., Marvell 88E1512).
- Automotive: ECU interfaces (e.g., NXP S32K144). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4-layer board with thermal vias under central pad (≥9 vias, 0.3 mm diameter).
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch leads.
- Reflow Profile: Ramp rate ≤2°C/s, peak temp 235–245°C (Pb-free).
- Inspection: AXI (Automated X-ray) required for lead coplanarity and void detection.



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