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QFP64

The QFP64 (Quad Flat Package with 64 pins) is a surface-mount package designed for high-density circuits. Featuring a compact form factor, exposed thermal pad, and fine pitch leads, it delivers reduced footprint, superior heat dissipation, and enhanced electrical performance. Typical dimensions are 10×10 mm with a height of 1.4 mm and a 0.5 mm pin pitch, making it ideal for microcontrollers, communication systems, and portable devices. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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