QFP64
- Bild & Models
- Beschreibung
- Unite Preis
- Menge
- Betrieb
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High-end In-vehicle Microcomputers for Body Applications
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 7559
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Universal Serial Bus single-chip host and device controller
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1600
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Embedded-Prozessoren & Controller
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 160
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Embedded-Prozessoren & Controller
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 628
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Embedded-Prozessoren & Controller
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2670
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Q:What defines the physical structure of QFP64?
A:Key features include:
- Leaded design: Gull-wing leads for reliable PCB mounting.
- Central thermal pad: Optional pad (typically 4×4 mm coverage) for heat dissipation.
- 64-pin layout: Quad Flat Package with leads on all four sides.
- Low profile: Standard thickness of 1.0–1.4 mm. -
Q:Why choose QFP64 over alternatives?
A:Critical advantages:
- Space efficiency: 30% smaller footprint than equivalent PLCC packages.
- Thermal performance: Exposed thermal pad (if present) enables direct PCB heat sinking.
- Electrical benefits: Low-inductance leads for stable high-frequency signals.
- Reliability: Molded plastic body with moisture resistance (JEDEC Level 3 compliant). -
Q:What are common technical specs for QFP64?
A:Standard configurations (consult datasheets):
- Body size: 10×10 mm to 14×14 mm (varies by vendor).
- Height: 1.0–1.4 mm.
- Pin pitch: 0.5 mm or 0.8 mm (common).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp range: -40°C to +125°C (industrial grade). -
Q:Where is QFP64 typically applied?
A:Dominant use cases:
- Microcontrollers: e.g., STM32F4 series (STMicroelectronics).
- Communication ICs: e.g., Ethernet PHYs (Microchip LAN8720).
- Industrial controls: Motor drivers (e.g., TI DRV88xx). -
Q:What are critical assembly guidelines for QFP64?
A:Key recommendations:
- PCB design: Thermal vias under central pad (if present); ensure solder mask dams.
- Solder paste: Type 3 or 4 recommended for fine-pitch (0.5 mm) variants.
- Reflow profile: Peak temp ≤ 250°C (lead-free) with controlled ramp rates.
- Inspection: AOI (Automated Optical Inspection) mandatory for lead coplanarity.



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