Startseite > Produkt der Kategorien > QFP 100

QFP 100

The QFP 100 (Quad Flat Package) is a surface-mount package designed for high-density circuits. Featuring fine pitch leads, an exposed thermal pad, and a low profile, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 14×14 mm with a height of 1.4 mm and a 0.5 mm pin pitch, making it ideal for power management ICs in portable devices, microcontrollers in consumer electronics, and automotive control systems. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
  • Bild & Models
  • Beschreibung
  • Unite Preis
  • Menge
  • Betrieb