QFP 208

The QFP 208 (Quad Flat Package 208) is a surface-mount package designed for high-density integrated circuits. Featuring fine pitch leads, an exposed thermal pad, and a low profile design, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 28×28 mm with a 0.5 mm pin pitch and a height of 3.4 mm, making it ideal for microcontrollers in embedded systems, communication devices, and consumer electronics. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.