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QFP 44

The QFP 44 (Quad Flat Package 44) is a surface-mount package designed for high-density integrated circuits. Featuring 44 leads arranged on four sides, a low-profile body, and gull-wing shaped leads, it delivers significant space savings, improved thermal performance, and ease of inspection and soldering. Typical dimensions are 7x7 mm or 10x10 mm with a 0.8 mm pin pitch and a typical height between 0.8 mm and 1.6 mm, making it ideal for microcontrollers, communication interface ICs, and consumer electronics. Its gull-wing leads enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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