QFP 44
- Bild & Models
- Beschreibung
- Unite Preis
- Menge
- Betrieb
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MCU 8Bit W78 8051 CISC ROMLess 5V 44Pin PQFP
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 54
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Satellite sound circuit with noise reduction
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1794
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Embedded-Prozessoren & Controller
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2604
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Speaker alnico 8ohm 2w 100mm sqr
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 652
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9-bit latched/registered/pass-thru Futurebus transceiver
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1130
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Q:What defines the physical structure of QFP 44?
A:Key features include:
- Gull-wing leads: 44 outward-bent pins for surface mounting.
- Central thermal pad: Optional 4×4 mm pad for heat dissipation (coverage varies by model).
- High-density layout: 44-pin configuration with perimeter lead arrangement.
- Low profile: Standard thickness of 1.0–1.4 mm. -
Q:Why choose QFP 44 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent DIP packages.
- Thermal Performance: Exposed die pad improves heat transfer to PCB.
- Electrical Benefits: Short lead lengths reduce inductance for high-frequency signals.
- Reliability: Moisture-resistant (MSL3-rated) epoxy body. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10×10 mm (±0.2 mm tolerance).
- Height: 1.4 mm (max).
- Pin Pitch: 0.8 mm (standard).
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is QFP 44 typically applied?
A:Dominant use cases:
- Consumer Electronics: MCUs in smart home devices (e.g., ESP32 modules).
- Automotive: ECU control units (e.g., NXP S32K144).
- Industrial: Motor drivers (e.g., TI DRV8876). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 0.3 mm thermal vias under the center pad (if present).
- Solder Paste: Type 3 or 4 recommended for fine-pitch leads.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: Optical/AXI required for lead coplanarity checks.



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