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SSOP-28

The SSOP-28 (Shrink Small Outline Package - 28 leads) is a surface-mount package designed for high-density circuits. Featuring an ultra-thin profile, an exposed thermal pad, and gull-wing leads, it delivers significant space savings and superior heat dissipation. Typical dimensions are 10.2 mm × 5.3 mm body with a 0.65 mm pin pitch and a 1.75 mm maximum height, making it ideal for communication interface ICs, portable electronics, and industrial control modules. Its integrated exposed pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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