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SSOP-56

The SSOP-56 (Shrink Small Outline Package) is a surface-mount package designed for high-density circuits. Featuring fine pitch design, exposed thermal pad, and ultra-thin profile, it delivers compact footprint and superior heat dissipation. Typical dimensions are 7.5 mm × 10.3 mm × 1.75 mm with a 0.65 mm pin pitch, making it ideal for power management ICs, communication systems, and consumer electronics. Its bottom-exposed pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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