SSOP-56
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RF Transceiver, 2400MHz to 2483.5MHz, GFSK, 250Kbps, 4dBm out, -95dBm in, 2.4V to 3.6V, HVQFN-48
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1495
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ARM MCU, LPC Family LPC1100 Series Microcontrollers, ARM Cortex-M0+, 32bit, 50 MHz, 256 KB, 36 KB
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 3194
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Analogue Switch, 4 Channels, SPST, 26 ohm, 3V to 16V, ± 3V to ± 8V, SOIC, 16 Pins
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 500
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TRIPP-LITE UR020-006 USB Cable Assembly, USB Type A Plug, USB Type A Plug, USB 2.0, 6Ft, 1.8m, Black
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 5487
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Position Sensor Development Tools EVK featuring the FIS1100 6-axis IMU
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1557
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Winbond Clock Generator For Intel 915/925 Chipsets
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1525
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Clock Synthesizer / Jitter Cleaner 200MHz Differential CPU Outputs
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1000
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200-MHz Spread Spectrum Clock Synthesizer/Driver
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 2000
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Clock Generator 14.318MHz-IN 166MHz-OUT 56-Pin SSOP
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 12897
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CPU SYSTEM CLOCK GENERATOR|CMOS|SSOP|56PIN|PLASTIC
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 3000
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CPU SYSTEM CLOCK GENERATOR|CMOS|SSOP|56PIN|PLASTIC
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 5508
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440BX AGPset Spread Spectrum Frequency Synthesizer
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 101
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Low-Voltage 24Bit FET Bus-Exchange Switch 56-SSOP -40℃ to 85℃
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1050
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Low-Voltage 16-Bit Registered Transceiver with 3.6-V Tolerant I...
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 1000
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9-Channel LVD-SCSI Transceiver 56-SSOP 0 to 70,Buffers & Line Drivers 9-Channel LVD-SCSI Transceiver
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1 + 10 + 25 + 50 + >=100 -
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Q:What defines the physical structure of SSOP-56?
A:Key features include:
- Gull-wing leads: Surface-mountable with outward-bent pins for robust soldering.
- High pin density: 56-pin layout in a compact dual-row configuration.
- Thin profile: Typical body thickness of 1.0 mm for space-constrained designs.
- Standardized footprint: Compatible with automated assembly processes. -
Q:Why choose SSOP-56 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC-56 with equivalent pin count.
- Thermal Performance: Exposed paddle option (e.g., 4×4 mm coverage) for enhanced heat dissipation.
- Electrical Benefits: Low-inductance leads (<1 nH) for high-speed signal integrity.
- Reliability: Moisture-resistant (MSL3-rated) mold compound for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 15.9 × 7.5 mm (nominal).
- Height: 1.0 mm (max).
- Pin Pitch: 0.5 mm (fine-pitch design).
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is SSOP-56 typically applied?
A:Dominant use cases:
- Data Communication: PHY chips (e.g., Texas Instruments DP83822).
- Industrial Control: Microcontroller interfaces (e.g., STMicroelectronics STM32).
- Consumer Electronics: Display drivers (e.g., Solomon Systech SSD2828). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 0.1-mm solder mask dams between pins to prevent bridging.
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: AOI (Automated Optical Inspection) mandatory for pin alignment.



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