TO:220
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600V DC-1 kHz (Standard) Copack IGBT in a TO-220AB package; A IRG4BC10SD with Standard Packaging
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 577750
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POWERLINE: RP30-S_DE - 2:1 Wide Input Voltage Range- 30 Watts Output Power- 1.6kVDC Isolation- Fixed Operating Frequency- Six-Sided Continuous Shield- International Safety Standard Approvals- Ul 1950 Component Recognised- Standard 50.8 x40.6x10.2mm P
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1 + 10 + 25 + 50 + >=100 -
Mindestbestellmenge : 1 Lagerbestand : 25
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Q:What defines the physical structure of TO-220?
A:Key features include:
- Through-hole mounting: Robust mechanical attachment with leads inserted into PCB.
- Integrated metal tab: Central thermal pad (~80% coverage) for heatsink attachment.
- 3-pin layout: Standard configuration with linear pin arrangement.
- Compact profile: Typical body height of 4.5–5 mm. -
Q:Why choose TO-220 over alternatives?
A:Critical advantages:
- Thermal Performance: Direct heatsink mounting (up to 50% better heat dissipation vs. TO-92).
- High Power Handling: Supports currents up to 75A (e.g., in power transistors).
- Durability: Flame-retardant epoxy body (UL94 V-0 rated).
- Cost-Effective: Widely available and compatible with automated assembly. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.4 × 4.6 mm (excluding leads).
- Height: 4.5–5 mm (varies by manufacturer).
- Pin Pitch: 2.54 mm (standard).
- Material: Copper-alloy leads, epoxy body.
- Temp Range: -40°C to +150°C (operational). -
Q:Where is TO-220 typically applied?
A:Dominant use cases:
- Power Electronics: Voltage regulators (e.g., LM7805), MOSFETs (e.g., IRF540N).
- Motor Drivers: H-bridge circuits in industrial systems.
- Audio Amplifiers: High-power output stages (e.g., TDA2030). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Ensure adequate trace width for high-current paths (≥2 oz copper recommended).
- Heatsinking: Thermal compound + mechanical fixation (e.g., screws/clips) for the metal tab.
- Wave Soldering: Preheat ≤ 100°C, solder pot at 260°C max.
- Inspection: Visual check for lead alignment and solder fillets.



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