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TQFP-100

The TQFP-100 (Thin Quad Flat Package with 100 leads) is a surface-mount package designed for high-density circuits. Featuring a thin profile, an exposed thermal pad, and fine pitch leads, it delivers compact size and superior heat dissipation. Typical dimensions are 14×14 mm with a 0.5 mm pin pitch, making it ideal for microcontrollers, digital signal processors, and portable consumer electronics. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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