Produkte > Integrierte Schaltungen (ICs) > Speicher > TE28F640C3BC80

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NOR Flash Parallel 3V/3.3V 64Mbit 4M x 16bit 80ns

  • Verpackung/Behälter :
  • TSSOP-48
  • Produkt der Kategorien :
  • Speicher
  • RoHs Status:
  • Lead free / RoHS Compliant
  • Lagerbestand:
  • 636


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TE28F640C3BC80 Beschreibung

Device This section provides an overview of the Intel® Advanced+ Boot Block Flash Memory (C3) device features, packaging, signal naming, and device architecture.Product Overview The C3 device provides high-performance asynchronous reads in package-compatible densities with a 16 bit data bus. Individually-erasable memory blocks are optimally sized for code and data storage. Eight 4 Kword parameter blocks are located in the boot block at either the top or bottom of the device’s memory map. The rest of the memory array is grouped into 32 Kword main blocks.Product



Flexible SmartVoltage Technology    —2.7 V– 3.6 V Read/Program/Erase    —12 V for Fast Production Programming 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option    —Reduces Overall System Power High Performance    —2.7 V– 3.6 V: 70 ns Max Access Time Optimized Architecture for Code Plus Data Storage    —Eight 4 Kword Blocks, Top or Bottom Parameter Boot    —Up to One Hundred-Twenty-Seven 32 Kword Blocks    —Fast Program Suspend Capability    —Fast Erase Suspend Capability Flexible Block Locking    —Lock/Unlock Any Block    —Full Protection on Power-Up    —WP# Pin for Hardware Block Protection Low Power Consumption    —9 mA Typical Read    —7 A Typical Standby with Automatic Power Savings Feature (APS) Extended Temperature Operation    —–40 °C to +85 °C 128-bit Protection Register    —64 bit Unique Device Identifier    —64 bit User Programmable OTP Cells Extended Cycling Capability    —Minimum 100,000 Block Erase Cycles Software    —Intel® Flash Data Integrator (FDI)    —Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice)    —Intel Basic Command Set    —Common Flash Interface (CFI) Standard Surface Mount Packaging    —48-Ball µBGA*/VFBGA    —64-Ball Easy BGA Packages    —48-Lead TSOP Package ETOX™ VIII (0.13 µm) Flash Technology    —16, 32 Mbit ETOX™ VII (0.18 µm) Flash Technology    —16, 32, 64 Mbit ETOX™ VI (0.25 µm) Flash Technology    —8, 16 and 32 Mbit

TE28F640C3BC80 Produkte

Technische Parameter

  • Hersteller
  • Verpackung
  • Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube
  • RoHs Status
  • Lead free / RoHS Compliant
  • Verpackung/Behälter
  • TSSOP-48

TE28F640C3BC80 Verwandte besondere

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    Alles super.Gerne wieder.

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Fracht Mehr
Estimated Delivery Time: Aug 24 - Aug 29 days (choose Expedited at checkout).

Fracht & Zahlung


  • Liefer-Type
  • Schiff Fee
  • Lead Time
  • $20.00-$40.00 (0.50 KG)
  • 2-5 days
  • $20.00-$40.00 (0.50 KG)
  • 3-7 days
  • $20.00-$45.00 (0.50 KG)
  • 2-5 days
  • $25.00-$65.00 (0.50 KG)
  • 2-5 days
  • $25.00-$45.00 (0.50 KG)
  • 5-14 days
  • $2.00-$3.00 (0.10 KG)
  • 7-30 days

Processing Time:Shipping fee depend on different zone and country.


  • Zahlungsbedingungen
  • Hand Fee
  • Payment Site
  • charge US$30.00 banking fee.
  • charge 4.0% service fee.
  • charge 3.5% service fee.
  • charge US$0.00 banking fee.
  • charge US$0.00 banking fee.

Wir bieten qualitativ hochwertige Produkte, aufmerksamen Service und nach dem Verkauf Garantie

  • Wir haben reiche Produkte, können Ihre verschiedenen Bedürfnisse erfüllen.

    Wir haben reiche Produkte, können Ihre verschiedenen Bedürfnisse erfüllen.

  • Mindestbestellmenge beginnt 1pcs.

    Mindestbestellmenge beginnt 1pcs.

  • Niedrigsten Transportgebühr beginnt bei US $ 2,00.

    Niedrigsten Transportgebühr beginnt bei US $ 2,00.

  • 90 Tage Qualitätsgarantie für alle Produkte.

    90 Tage Qualitätsgarantie für alle Produkte.


  • Step1:Product

    Step1: Products

  • Step2:Vacuum packaging

    Step2: Vacuum Packaging

  • Step3:Anti-static bag

    Step3: Anti-Static Bag

  • Step4:Individual packaging

    Step4: Individual Packaging

  • Step5:Packaging boxes

    Step5: Packaging Boxes

  • Step6:bar-code shipping tag

    Step6: Bar-Code Shipping Tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Jotrin ESD packing


1.We provide 90 days warranty.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


Q: How does Jotrin guarantee that TE28F640C3BC80 is the original manufacturer or agent of INTEL?
We have a professional business development department to strictly test and verify the qualifications of INTEL original manufacturers and agents. All INTEL suppliers must pass the qualification review before they can publish their TE28F640C3BC80 devices; we pay more attention to the channels and quality of TE28F640C3BC80 products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
Q: How to find the detailed information of TE28F640C3BC80 chips? Including INTEL original factory information, application, TE28F640C3BC80 pictures?
You can use Jotrin's intelligent search engine, or filter by Speicher category, or find it through Intel Corp Information page.
Q: Are the INTEL's TE28F640C3BC80 price and stock displayed on the platform accurate?
The INTEL's inventory fluctuates greatly and cannot be updated in time, it will be updated periodically within 24 hours. After submitting an order for TE28F640C3BC80, it is recommended to confirm the order with Jotrin salesperson or online customer service before payment.
Q: Can I place an order offline?
Yes. We accept offline orders.
We can provide order placement service. You only need to log in, click "My Orders" to enter the transaction management, and you will see the "Order Details" interface. After checking it, select all and click "Place Order". In addition, you can enjoy coupons or other selected gifts when placing orders online.
Q: What forms of payment can I use in Jotrin?
TT Bank, Paypal, Credit Card, Western Union, and Escrow is all acceptable.
Q: How is the shipping arranged and track my package?
Customers can choose industry-leading freight companies, including DHL, FedEx, UPS, TNT, and Registered Mail.
Once your order has been processed for shipment, our sales will send you an e-mail advising you of the shipping status and tracking number.
Note: It may take up to 24 hours before carriers will display tracking information. In normal conditions, Express delivery needs 3-5 days, Registered Mail needs 25-60 days.
Q: What is the process for returns or replacement of TE28F640C3BC80?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the TE28F640C3BC80 we delivered, we will accept the replacement or return of the TE28F640C3BC80 only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of TE28F640C3BC80.
(3)The TE28F640C3BC80 is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
More details about return electronic components please see our Return & Change Policy.
Q: How to contact us and get support, such as TE28F640C3BC80 datasheet pdf, TE28F640C3BC80 pin diagram?
Need any After-Sales service, please feel free contact us:

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Intel Corporation is the world's largest semiconductor chip maker. Intel has been committed to the development of small, fast and energy-saving technologies to help mobile computing, desktop computin and data centers to achieve revolutionary advances in computing, and to promote fundamental changes...
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