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XC3S400AN-4FGG400C

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Extended Spartan-3A FPGAs, Package: 4FGG400C

Hersteller : AMD Xilinx, Inc
Verpackung/Behälter : FBGA400
Produkt der Kategorien : FPGAs
Datasheet: XC3S400AN-4FGG400C Datasheet (PDF)
RoHs Status: Lead free/RoHS Compliant
Lagerbestand: 1000

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XC3S400AN-4FGG400C Beschreibung

Introduction:

The Spartan®-3AN FPGA family combines the best attributes of a leading edge, low cost FPGA with nonvolatile technology across a broad range of densities. The family combines all the features of the Spartan-3A FPGA family plus leading technology in-system
Flash memory for configuration and nonvolatile data storage. The Spartan-3AN FPGAs are part of the Extended Spartan-3A family, which also includes the Spartan-3A FPGAs and the higher density Spartan-3A DSP FPGAs. The Spartan-3AN FPGA family is excellent for space-constrained applications such as blade servers, medical devices, automotive infotainment, telematics, GPS, and other small consumer products. Combining FPGA and Flash technology minimizes chip count, PCB traces and overall size while increasing system reliability. The Spartan-3AN FPGA internal configuration interface is completely self-contained, increasing design security. The family maintains full support for external configuration. The Spartan-3AN FPGA is the world’s first nonvolatile FPGA with MultiBoot,

supporting two or more configuration files in one device, allowing alternative configurations for field upgrades, test modes, or multiple system configurations.

Features:

• The new standard for low cost nonvolatile FPGA solutions
• Eliminates traditional nonvolatile FPGA limitations with the
  advanced 90 nm Spartan-3A device feature set
• Memory, multipliers, DCMs, SelectIO, hot swap, power
  management, etc.
• Integrated robust configuration memory
• Saves board space
• Improves ease-of-use
• Simplifies design
• Reduces support issues
• Plentiful amounts of nonvolatile memory available to the user
• Up to 11+ Mb available
• MultiBoot support
• Embedded processing and code shadowing
• Scratchpad memory
• Robust 100K Flash memory program/erase cycles
• 20 years Flash memory data retention
• Security features provide bitstream anti-cloning protection
• Buried configuration interface
• Unique Device DNA serial number in each device for
  design Authentication to prevent unauthorized copying
• Flash memory sector protection and lockdown
• Configuration watchdog timer automatically recovers from
  configuration errors
• Suspend mode reduces system power consumption
• Retains all design state and FPGA configuration data
• Fast response time, typically less than 100 μs
• Full hot-swap compliance
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 502 I/O pins or 227 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal
  standards
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Up to 24 mA output drive
• 3.3V ±10% compatibility and hot swap compliance
• 622+ Mb/s data transfer rate per I/O
• DDR/DDR2 SDRAM support up to 400 Mb/s
• LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL
  differential I/O
• Abundant, flexible logic resources
• Densities up to 25,344 logic cells
• Optional shift register or distributed RAM support
• Enhanced 18 x 18 multipliers with optional pipeline
• Hierarchical SelectRAM™ memory architecture
• Up to 576 Kbits of dedicated block RAM
• Up to 176 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
• Eight global clocks and eight additional clocks per each half
  of device, plus abundant low-skew routing
• Complete Xilinx® ISE® and WebPACK™ software
  development system support
• MicroBlaze™ and PicoBlaze embedded processor cores
• Fully compliant 32-/64-bit 33 MHz PCI™ technology support
• Low-cost QFP and BGA Pb-free (RoHS) packaging options
• Pin-compatible with the same packages in the
  Spartan-3A FPGA family

XC3S400AN-4FGG400C

Feature

• Low-cost, high-performance logic solution for high-volume,
consumer-oriented applications
• Densities up to 74,880 logic cells
• SelectIO™ interface signaling
• Up to 633 I/O pins
• 622+ Mb/s data transfer rate per I/O
• 18 single-ended signal standards
• 8 differential I/O standards including LVDS, RSDS
• Termination by Digitally Controlled Impedance
• Signal swing ranging from 1.14V to 3.465V
• Double Data Rate (DDR) support
• DDR, DDR2 SDRAM support up to 333 Mb/s
• Logic resources
• Abundant logic cells with shift register capability
• Wide, fast multiplexers
• Fast look-ahead carry logic
• Dedicated 18 x 18 multipliers
• JTAG logic compatible with IEEE 1149.1/1532
• SelectRAM™ hierarchical memory
• Up to 1,872 Kbits of total block RAM
• Up to 520 Kbits of total distributed RAM
• Digital Clock Manager (up to four DCMs)
• Clock skew elimination
• Frequency synthesis
• High resolution phase shifting

XC3S400AN-4FGG400C Produkte

Technische Parameter

  • Number of LABs/CLBs
  • 896
  • Number of Logic Elements/Cells
  • 8064
  • Total RAM Bits
  • 368640
  • Number of I/O
  • 311
  • Number of Gates
  • 400000
  • Voltage Supply
  • 1.14V ~ 1.26V
  • Mounting Type
  • Surface Mount
  • Operating Temperature
  • 0??C ~ 85??C (TJ)
  • Package / Case
  • 400-BGA
  • Supplier Device Package
  • 400-FBGA (21x21)

XC3S400AN-4FGG400C Datasheet

XC3S400AN-4FGG400C Verwandte besondere

Ratings and Reviews (1)

  • 5 / 5
  • 5 Stars 100%
  • 4 Stars 0%
  • 3 Stars 0%
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  • 1 Stars 0%
  • **藤 政***
    2020-03-28

    Great product Fast Delivery Apleasant easy transaction Excellent supplier+++++++++

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  • $2.00-$3.00 (0.10 KG)
  • 7-30 days

Processing Time:Shipping fee depend on different zone and country.


Zahlung

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  • charge US$30.00 banking fee.
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  • Mindestbestellmenge beginnt 1pcs.

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    Niedrigsten Transportgebühr beginnt bei US $ 2,00.

  • 90 Tage Qualitätsgarantie für alle Produkte.

    90 Tage Qualitätsgarantie für alle Produkte.

Verpackung

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  • Step2:Vacuum packaging

    Step2: Vacuum Packaging

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  • Step4:Individual packaging

    Step4: Individual Packaging

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    Step5: Packaging Boxes

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    Step6: Bar-Code Shipping Tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

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Garantien

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

FAQ:

Q: How does Jotrin guarantee that XC3S400AN-4FGG400C is the original manufacturer or agent of XILINX?
We have a professional business development department to strictly test and verify the qualifications of XILINX original manufacturers and agents. All XILINX suppliers must pass the qualification review before they can publish their XC3S400AN-4FGG400C devices; we pay more attention to the channels and quality of XC3S400AN-4FGG400C products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
Q: How to find the detailed information of XC3S400AN-4FGG400C chips? Including XILINX original factory information, FPGAs application, XC3S400AN-4FGG400C pictures?
You can use Jotrin's intelligent search engine, or filter by Spartan-3 FPGA category, or find it through AMD Xilinx, Inc Information page.
Q: Are the XILINX's XC3S400AN-4FGG400C price and stock displayed on the platform accurate?
The XILINX's inventory fluctuates greatly and cannot be updated in time, it will be updated periodically within 24 hours. After submitting an order for XC3S400AN-4FGG400C, it is recommended to confirm the order with Jotrin salesperson or online customer service before payment.
Q: Can I place an order offline?
Yes. We accept offline orders.
We can provide order placement service. You only need to log in, click "My Orders" to enter the transaction management, and you will see the "Order Details" interface. After checking it, select all and click "Place Order". In addition, you can enjoy coupons or other selected gifts when placing orders online.
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Q: How is the shipping arranged and track my package?
Customers can choose industry-leading freight companies, including DHL, FedEx, UPS, TNT, and Registered Mail.
Once your order has been processed for shipment, our sales will send you an e-mail advising you of the shipping status and tracking number.
Note: It may take up to 24 hours before carriers will display tracking information. In normal conditions, Express delivery needs 3-5 days, Registered Mail needs 25-60 days.
Q: What is the process for returns or replacement of XC3S400AN-4FGG400C?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC3S400AN4FGG400C we delivered, we will accept the replacement or return of the XC3S400AN-4FGG400C only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XC3S400AN-4FGG400C.
(3)The XC3S400AN-4FGG400C is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
More details about return electronic components please see our Return & Change Policy.
Q: How to contact us and get support, such as XC3S400AN-4FGG400C datasheet pdf, XC3S400 pin diagram?
Need any After-Sales service, please feel free contact us: sales@jotrin.com

AMD Xilinx, Inc

Xilinx
Xilinx is the inventor of the FPGA, CPLDs, programmable SoCs, and now, the ACAP, their highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud....

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