Acetone, Alcohol, Nitric acid and Sulfuric acid are used be the chemical raw materials for analysis.
We scrub the surface of component by Acetone in a certain direction with fixed number of times,to ensure that whether the component was reprocessed or reworked.
The chemical materials of IC products need dissect through immersion, the first get rid of the surface of the epoxy resin products,
second remove the gold and wafer. so the original loge of wafer, defects, good or not will be showed by HD microscope that know
the reason for the failure products. Expecially the chemical anatomy soaking technicians of us have long experiences with 10years
in every immersion dissection process to maintain a high lever.
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