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Startseite > Technologies Of Ironwood Electronics, Inc

Technologies Of Ironwood Electronics, Inc

  • High-performance socket allows for a 0.65mm pitch
    • High-performance socket allows for a 0.65mm pitch

      Ironwood Electronics' new high performance socket - SFS-BGA500C-52 allows 0.65mm pitch, 14x17mm body, 20X25 array 500 ball BGA package to be placed in socket and operated without compromising performance in high-speed applications. The Giga-snaP BGA socket ada...

    • Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
  • Test socket achieves 31 gram actuation force per ball
    • Test socket achieves 31 gram actuation force per ball

      Ironwood Electronics (Eagan, MN) recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA243 - CBT-BGA-7020. The contactor is a stamped spring pin with 31 gram actuation force per ball and ...

    • Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
  • QFN socket designed for Microchip's 10TDFN
    • QFN socket designed for Microchip's 10TDFN

      Ironwood Electronics recently introduced a new QFN socket addressing high performance requirements for testing QFN devices - CBT-QFN-7039. The contactor is a stamped spring pin with 17 gram actuation force per ball and cycle life of 50,000 insertions. The self...

    • Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
  • Socket suits 1-mm pitch, 1924 pin BGA ICs
    • Socket suits 1-mm pitch, 1924 pin BGA ICs

      Ironwood Electronics (Eagan, MN) has introduced a new high performance BGA socket for 1-mm pitch, 1924 pin BGA ICs. The SG-BGA-6409 socket is designed for two different IC sizes – 45 mm x 45 mm and 47.5 mm x 47.5 mm package size and operates…

    • Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
 

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