- Alle
- Bluetooth 5
- NB-IoT
- 5G
- Wireless charging
- Lidar
- ADAS
- LoRa
- Type C
- Motor Control
- Energy collection
- Connector
- Photoelectric Display
- Fast charging technology
- EDA/IC Design
- Interface/Bus/Driver
- RF/Wireless
- Manufacturing/Packaging
- Measuring Instrument
- power-new-energy
- EMC/EMI design
- Storage technology
- Processor/DSP
- Control / MCU
- Analog technology
- Embedded technology
- MEMS / sensing technology
- Programmable logic
- Other
EDA/IC Design
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How to break through the yield problem after the chip process reaches 3nm?
SAMSUNG Electronics has been spending more than 20 years on GAA, so why is the y...
- Veröffentlichte Zeit: 2022-11-30 Einzelheiten ›
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How to choose a single-cell battery charging IC
In the power management ICs, battery charging ICs are a class of devices that re...
- Veröffentlichte Zeit: 2022-09-19 Einzelheiten ›
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The working principle and proper use of capacitors in power supply design
The power supply is the most neglected aspect of the circuit design process. As ...
- Veröffentlichte Zeit: 2022-07-13 Einzelheiten ›
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DC-DC Circuit Design Concepts and Features
DC-DC refers to direct current power (Direct Current). It is a device that chang...
- Veröffentlichte Zeit: 2022-05-30 Einzelheiten ›
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ATMEL Component naming conventions and IC packaging
From this article you will get more information about IC packaging and naming c...
- Veröffentlichte Zeit: 2020-04-07 Einzelheiten ›
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Electromagnetic design software uses parallel processing to accelerate multiphysics analysis
Cobham Technical Services has released a new version of its Opera electromagneti...
- Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
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Full-bridge driver IC designed to operate one bipolar stepper or two brush DC motors
Allegro MicroSystems, LLC introduces a new, dual full-bridge driver designed to ...
- Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
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Linear hall-effect sensor IC designed with low noise and high resolution
Allegro MicroSystems, LLC (Worcester, MA) announces a new factory-programmable l...
- Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
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Development kit streamlines application-specific design process using mini low power MCUs
LAPIS Semiconductor Co. Ltd., a ROHM Group Company, (Santa Clara, CA) introduced...
- Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
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Integrated MMIC designed for commercial radar applications
M/A-COM Technology Solutions announced the industry’s first integrated core chip...
- Veröffentlichte Zeit: 2019-12-20 Einzelheiten ›
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